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Spellbinder Dies in Sissix Big Shot
I believe it's possible to use the Spellbinder Dies on the old blue Sissix-Ellison Big Shot. Has anyone tried this and how do you make up the 'sandwich' to get it to cut?
They cut just fine, using the multi platform. Use all the layers.
I'm not certain what you are referring to as the old Sizzix-Ellison Big Shot, but the one I am using is about 3 years old and came from Stampin' Up (made by Sizzix). I use Spellbinder dies in it all the time.
My Big Shot came with the Multipurpose Platform (3 pieces hinged together at one edge: the main platform is about 1.2 mm thick, tab 1 is less than 1 mm thick, and tab 2 is about 2 mm thick).
Here is the "sandwich" I use on mine, starting with the bottom layer first and working up:
For cutting with Spellbinder dies:
- The multipurpose platform with all 3 tabs being used
- a clear cutting plate
- the Spellbinder die with sharp (cutting) edge facing up
- the cardstock or paper I want to cut placed on top of the die
- another clear cutting plate.
For embossing with Spellbinder dies:
- The main (thickest) platform and tab 1
- a clear cutting plate
- the Spellbinders die with the cardstock or paper still in place in it, with cutting edge facing up
- the Sizzix silicon rubber pad on top of the die
- the hard black plastic Sizzix Impressions pad on top of the silicon pad
(note-do not use a second clear cutting plate on top of the whole thing, or try to substitute one for the black impressions pad. It is too thick.
I hope this helps. If this does not apply to the blue Big Shot you were talking about, my apologies.
Not my post,
but just want to say thank you for the very useful information, it's always nice when experienced crafter's share information.
Have caught a bug! Scrapping!
Originally Posted by JanW
I think you are referring to the Blue Big Kick? I have the pink one.
Exactly as someone before me quoted using the Stampin Up one which is the same as the Sizzix Black & Pink one. Basically you just need to ensure that you have the right thickness to encourage the paper to cut.
I use the Solo Platform, plus Solo Thin Die Adapter and the Solo Shim which is wafer thin. The Solo Shim slots into the bottom layer, Solo Platform and has the Adapter in the middle. Then i use a clear plate, paper and die and a 2nd plate on top.
I can get all that thru my Big Kick or Big Shot easily and it should only need one cut thru the machine.
Hope that helps you. If you are actually unsure, just check the instructions on each solo platform, adapter and shim pad. It explains how to build it up as well as giving you diagram pictures of what you should be using.
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